• Samsung is mass producing 4-Gbit DDR3 DRAM

• Point/Counterpoint: Is CMOS right for 3G handset PAs?

• Apple gets hefty margin on iPad cost

• Toyota recalls: Deeper engineering implications

• Renesas readies MCU plant in China

• Altera to offer partial reconfiguration at 28-nm

• Analyst rails against the fab-lite

• Displays shine a light on Apple tablet

• Xilinx to go with TSMC at 28-nm, says analyst

• Is 450-mm delayed amid lackluster support?
• Intel helps lead Europe's 450-mm wafer initiative
• Benchmark raises Q4 revenue estimate
• Samsung uses 30-nm NAND flash for mobile memories

• ISS: Panelists debate fate of IC manufacturing

• GlobalFoundries, Qualcomm ink foundry deal

• 'Skiff' e-reader uses LG's flexible backplane
• CES: Lenovo shows hybrid x86/ARM notebook

• Vizio puts 60 GHz in HDTVs, but not Blu-ray drives
• Survey finds manufacturing moving back to UK

• Altis to join foundry fray, Infineon says

• NXP licenses contactless IC technology to ST

• Hynix rolls 'eco-friendly' DDR3 device
• Analysis: What it takes to build 18-Mpixel basic phones

• Nvidia won't build chipsets for Intel's Nehalem

About the EETimes Supply Network Operations Section
The Operations section of EETimes Supply Network provides news and analysis of operational issues both within the original equipment manufacturer’s (OEM) four walls and by their contract manufacturing (CM) suppliers, including electronics manufacturing service (EMS) providers and original design manufacturers (ODM). A major area of coverage is efficiency and cost reductions enabled by software tools for product lifecycle management (PLM) and business process re-engineering philosophies such Lean Manufacturing and Lean Supply Chain Management.